ImpulsTec’s frag­men­ta­tion sys­tems can be used for dis­as­sem­bly of com­plex devices such as mobile phones and lap­tops into com­po­nents, for detach­ing of elec­tron­ic com­po­nents from print­ed cir­cuit boards and the sep­a­ra­tion of com­po­nents such as proces­sors and tan­ta­lum capac­i­tors into their dif­fer­ent materials.

The homo­ge­neous ener­gy input of the shock wave process into the device leads to the break up of the assem­blies at their mechan­i­cal weak points, which are typ­i­cal­ly joints and inter­faces between dif­fer­ent mate­ri­als. This allows elec­tron­ic equip­ment to be almost per­fect­ly sep­a­rat­ed into their main com­po­nents, such as frame parts, print­ed cir­cuit boards, and oth­er plas­tic or met­al pieces.